• Medientyp: Buch
  • Titel: Mechanical design of electronic sytems
  • Enthält: Electronic components and semiconductors services. -- Circuit analysis. -- First level packaging: the chip carrier. -- Second level packaging: substrates and printed circuit boards. -- Production of printed circuit boards. -- Electronics manufacturing: chip carrier to substrate. -- Third level packaging: connectors, cables, modules, card cages and cabinet. -- Thermal analysis methods: conduction. -- Thermal analysis methods: radiation and convection. -- Stress and failure: analysis of mechanical components. -- Thermo-mechanical analysis. -- Analysis of vibration of electronic equipment. -- Theory of reliability. -- Design to improve reliability.
  • Beteiligte: Dally, James W. [VerfasserIn]; Lall, Pradeep [VerfasserIn]; Suhling, Jeffrey C. [VerfasserIn]
  • Erschienen: Knoxville, Tennessee: College House Enterprises, LLC, [2008]
  • Umfang: xiv, 648 Seiten; Illustrationen, Diagramme
  • Sprache: Englisch
  • ISBN: 9780976241331; 0976241331
  • RVK-Notation: ZN 4192 : Technologie diskreter Bauelemente (Bonden; Gehäuse); Packaging
  • Schlagwörter: Electronic packaging ; Electronic systems Design and construction
  • Entstehung:
  • Anmerkungen: Includes bibliographic references and index
  • Beschreibung: Electronic components and semiconductors services. -- Circuit analysis. -- First level packaging: the chip carrier. -- Second level packaging: substrates and printed circuit boards. -- Production of printed circuit boards. -- Electronics manufacturing: chip carrier to substrate. -- Third level packaging: connectors, cables, modules, card cages and cabinet. -- Thermal analysis methods: conduction. -- Thermal analysis methods: radiation and convection. -- Stress and failure: analysis of mechanical components. -- Thermo-mechanical analysis. -- Analysis of vibration of electronic equipment. -- Theory of reliability. -- Design to improve reliability

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  • Status: Ausleihbar
  • Signatur: 2017 4 004110
  • Barcode: 11945053N