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Medientyp:
Buch
Titel:
Mechanical design of electronic sytems
Enthält:
Electronic components and semiconductors services. -- Circuit analysis. -- First level packaging: the chip carrier. -- Second level packaging: substrates and printed circuit boards. -- Production of printed circuit boards. -- Electronics manufacturing: chip carrier to substrate. -- Third level packaging: connectors, cables, modules, card cages and cabinet. -- Thermal analysis methods: conduction. -- Thermal analysis methods: radiation and convection. -- Stress and failure: analysis of mechanical components. -- Thermo-mechanical analysis. -- Analysis of vibration of electronic equipment. -- Theory of reliability. -- Design to improve reliability.
Anmerkungen:
Includes bibliographic references and index
Beschreibung:
Electronic components and semiconductors services. -- Circuit analysis. -- First level packaging: the chip carrier. -- Second level packaging: substrates and printed circuit boards. -- Production of printed circuit boards. -- Electronics manufacturing: chip carrier to substrate. -- Third level packaging: connectors, cables, modules, card cages and cabinet. -- Thermal analysis methods: conduction. -- Thermal analysis methods: radiation and convection. -- Stress and failure: analysis of mechanical components. -- Thermo-mechanical analysis. -- Analysis of vibration of electronic equipment. -- Theory of reliability. -- Design to improve reliability